Jonathan R Smith

Title: Innovations of Jonathan R Smith in Medical Device Technology

Introduction

Jonathan R Smith is an accomplished inventor based in Gilbert, AZ (US). He has made significant contributions to the field of medical devices, particularly through his innovative patent related to hermetic wafer-to-wafer bonding.

Latest Patents

Jonathan holds a patent for "Hermetic wafer-to-wafer bonding with electrical interconnection." This patent describes an implantable medical device (IMD) that includes a first substrate with a front side and a backside. A first via is formed in the front side, extending from a bottom point to a specific height at the surface. A first conductive pad is created within this via, having an exposed top surface lower than the first height. A second substrate is coupled to the first, featuring a second via that also extends from a bottom point to a designated height. A second conductive pad is formed in this via, similarly having an exposed top surface lower than the second height. The substrates are heated until a portion of one or both conductive pads reflow, dewet, agglomerate, and merge to create an interconnect, hermetic seal, or both, depending on the device's requirements. Jonathan's innovative approach has the potential to enhance the functionality and reliability of implantable medical devices.

Career Highlights

Jonathan is currently employed at Medtronic, Inc., a leading company in the medical technology sector. His work focuses on advancing the design and functionality of medical devices, contributing to improved patient outcomes.

Collaborations

Jonathan has collaborated with notable colleagues, including David A Ruben and Michael F Mattes, who share his commitment to innovation in medical technology.

Conclusion

Jonathan R Smith's contributions to the field of medical devices through his patent on hermetic wafer-to-wafer bonding exemplify his dedication to innovation. His work at Medtronic, Inc. continues to push the boundaries of technology in healthcare.