Company Filing History:
Years Active: 2021
Title: Innovations of Jonathan Minter in Lead-Free Solder Technology
Introduction
Jonathan Minter is an accomplished inventor based in Utica, NY (US). He has made significant contributions to the field of solder technology, particularly in the development of lead-free solder preforms. His innovative approach addresses the challenges associated with high-temperature solder applications.
Latest Patents
Jonathan Minter holds a patent for a Hybrid High Temperature Lead-Free Solder Preform. This invention features a core layer and an adhesion layer coated over the surfaces of the core layer. The preform combines the merits of constituent solder alloys from both layers, providing high-temperature performance and improved wetting in applications such as die attach. The core layer is formed of a Bi Alloy with a solidus temperature above 260°C, while the adhesion layer can be made from various materials, including Sn, Bi alloys, and In alloys, with a solidus temperature below 245°C. The solder preform can be manufactured using techniques such as electroplating, cladding, or dipping.
Career Highlights
Jonathan Minter is currently employed at Indium Corporation, where he continues to innovate in the field of solder technology. His work has been instrumental in advancing lead-free solder solutions that meet the demands of modern electronics.
Collaborations
Jonathan has collaborated with notable colleagues, including Hongwen Zhang and Joseph Wu, who share his commitment to innovation in solder technology.
Conclusion
Jonathan Minter's contributions to lead-free solder technology exemplify the importance of innovation in the electronics industry. His patent for the Hybrid High Temperature Lead-Free Solder Preform showcases his dedication to developing solutions that enhance performance and reliability.