Algonquin, IL, United States of America

Jon Wendling

This inventor holds 1 USPTO granted patent. Top assignee: Zip-Pak Incorporated. Active years: 1990.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jon Wendling. Retrieved from https://idiyas.com/inventor/jon-wendling

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 1990

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Jon Wendling

Introduction

Jon Wendling is an accomplished inventor based in Algonquin, Illinois. He has made significant contributions to the field of packaging technology through his innovative designs and patents. His work focuses on enhancing the efficiency and precision of packaging machinery.

Latest Patents

Wendling holds a patent for an Ultrasonic Web Edge Guide Circuit. This ultrasonic servo controller circuit is designed to detect the edge of a web and adjust its position as it is dispensed from a pay-off roll to packaging machinery. The circuit effectively controls a motor that operates a linear actuator, which helps to 'de-oscillate' the web. This innovation ensures that the packaging machinery receives a steady, non-oscillating sheet of material, improving the overall packaging process.

Career Highlights

Jon Wendling is currently employed at Zip-Pak Incorporated, where he continues to develop and refine technologies that enhance packaging solutions. His expertise in ultrasonic technology has positioned him as a valuable asset in the industry.

Collaborations

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Conclusion

Jon Wendling's contributions to the field of packaging technology through his innovative patent demonstrate his commitment to improving industry standards. His work continues to influence the efficiency of packaging machinery, showcasing the importance of innovation in this sector.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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