Appleton, WI, United States of America

Jon M Pietsch

This inventor holds 2 USPTO granted patents. Top assignee: Curwood, Inc.. Active years: 2013-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jon M Pietsch. Retrieved from https://idiyas.com/inventor/jon-m-pietsch

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 2

Forward Citations = 24(Granted Patents)


Company Filing History:


Years Active: 2013-2015

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2 patents (USPTO):Explore Patents

Title: Jon M Pietsch: Innovator in Flexible Packaging

Introduction

Jon M Pietsch is a notable inventor based in Appleton, WI (US). He has made significant contributions to the field of flexible packaging, holding 2 patents to his name. His work has been instrumental in advancing packaging solutions that meet modern consumer needs.

Latest Patents

Among his latest innovations is the flexible pouch, which showcases his commitment to enhancing packaging functionality and sustainability. This invention reflects the growing demand for versatile and eco-friendly packaging options in various industries.

Career Highlights

Jon M Pietsch is currently employed at Curwood, Inc., a company renowned for its innovative packaging solutions. His role at Curwood has allowed him to leverage his expertise in developing cutting-edge packaging technologies that cater to diverse market requirements.

Collaborations

Jon has collaborated with his coworker, Stephen M Kilber, to further enhance the innovative capabilities within their team. Their combined efforts have contributed to the success of various projects at Curwood, Inc.

Conclusion

Jon M Pietsch is a distinguished inventor whose work in flexible packaging continues to influence the industry. His patents and collaborations reflect a dedication to innovation and excellence in packaging solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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