Kalispell, MT, United States of America

Jon Kuntz


Average Co-Inventor Count = 4.4

ph-index = 2

Forward Citations = 14(Granted Patents)


Company Filing History:


Years Active: 2004-2005

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2 patents (USPTO):Explore Patents

Title: Jon Kuntz: Innovator in Semiconductor Processing Technology

Introduction

Jon Kuntz is a notable inventor based in Kalispell, MT (US), recognized for his contributions to semiconductor processing technology. With a total of 2 patents, Kuntz has developed innovative systems that enhance the efficiency and effectiveness of wafer processing.

Latest Patents

Kuntz's latest patents include a "Single Workpiece Processing System" and a "Sonic Immersion Process System and Methods." The Single Workpiece Processing System features a robot that loads and unloads workpieces into processors. This system utilizes alignment pins and rotors to create a processing chamber, ensuring precise centering of the workpiece. The centrifugal force generated during spinning distributes processing fluid across the workpiece surface, while purge gas aids in fluid removal. The Sonic Immersion Process System involves a head that spins the workpiece and lowers it into a liquid bath. Sonic energy is introduced to assist in processing, followed by rinsing and drying procedures to ensure optimal results.

Career Highlights

Kuntz has made significant strides in his career at Semitool, Inc., where he has applied his expertise in semiconductor technology. His innovative approaches have contributed to advancements in the field, making him a valuable asset to his company.

Collaborations

Throughout his career, Kuntz has collaborated with talented individuals such as Steven L Peace and Kyle Moran Hanson. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Jon Kuntz stands out as an influential inventor in the semiconductor industry, with his patents reflecting a commitment to innovation and excellence. His work continues to impact the field, paving the way for future advancements in wafer processing technology.

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