Jon E Bengston

Title: Innovations by Jon E Bengston

Introduction

Jon E Bengston is a notable inventor based in West Hartford, CT (US). He has made significant contributions to the field of electroless plating, holding a total of 4 patents. His work focuses on methods that enhance the plating process, particularly involving palladium and copper.

Latest Patents

Bengston's latest patents include a method for electroless plating of palladium phosphorus directly on copper. This innovative solution comprises a palladium compound and a polyaminocarboxylic compound, which serves as a bath for electroless plating. The resulting plated component features a copper surface with a palladium coating that ranges in thickness from 0.01 micrometers (μm) to 5 μm. Another significant patent involves a composition and method for electroless plating of palladium phosphorus on copper, which similarly utilizes a palladium compound and a polyaminocarboxylic compound to achieve a high-quality palladium layer on copper surfaces.

Career Highlights

Throughout his career, Jon E Bengston has worked with various companies, including Uyemura International Corporation. His expertise in electroless plating has positioned him as a valuable asset in the industry, contributing to advancements in plating technology.

Collaborations

Bengston has collaborated with notable coworkers such as David Crotty and Mark Wojtaszek. Their combined efforts have furthered the development of innovative plating methods and technologies.

Conclusion

Jon E Bengston's contributions to the field of electroless plating have led to significant advancements in the industry. His patents reflect a commitment to innovation and quality in plating processes.