Company Filing History:
6 out of 31 
2 out of 137 
1 out of 42 
Years Active: 1994-2009
Title: The Innovations of John W Schaefer
Introduction
John W Schaefer is a notable inventor based in Wilmington, DE (US). He has made significant contributions to the field of thermogravimetric analysis, holding a total of 9 patents. His work focuses on improving the accuracy and reliability of weight measurements during thermal analysis.
Latest Patents
One of his latest patents is titled "System and method for a thermogravimetric analyzer having improved dynamic weight baseline." This invention includes systems and methods for minimizing extraneous forces and calculating corrected weights of samples based on buoyancy factors for a thermogravimetric analyzer (TGA). The TGA features a balance chamber and a furnace designed to heat samples. A null balance is utilized in the balance chamber to measure the sample weight change during heating. The furnace consists of a cylinder that is open at the top to receive a sample, with the bottom closed except for a small hole for a thermocouple. An infrared heat source may be included to heat the cylinder. The balance chamber is thermally isolated from the furnace using an actively cooled plate and a system of heat shields. Additionally, a thermocouple disk is provided to limit gas flow in the furnace, enhancing the reliability of sample weight measurements.
Career Highlights
Throughout his career, John W Schaefer has worked with prominent companies such as TA Instruments, Inc. and Waters Investments Limited. His expertise in thermogravimetric analysis has positioned him as a key figure in the development of innovative analytical instruments.
Collaborations
Some of his notable coworkers include Robert L Danley and Kevin J Reed. Their collaborative efforts have contributed to advancements in the field of thermal analysis.
Conclusion
John W Schaefer's contributions to thermogravimetric analysis through his patents and collaborations highlight his significant impact on the field. His innovative approaches continue to enhance the accuracy and reliability of thermal measurements.