San Jose, CA, United States of America

John T MacKay


Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 33(Granted Patents)


Company Filing History:


Years Active: 1999-2000

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2 patents (USPTO):Explore Patents

Title: John T. MacKay: Innovator in Solder Printing Technology

Introduction

John T. MacKay, an accomplished inventor based in San Jose, California, has made significant contributions to the field of integrated circuit manufacturing. With two patents to his name, MacKay has been instrumental in advancing solder printing and reflow methods, essential for producing high-density solder bumps on circuit boards.

Latest Patents

MacKay's latest inventions revolve around the "Captured-cell solder printing and reflow methods and apparatuses." These patents disclose innovative methods and devices for forming solder bumps on integrated circuits and similar units. The process involves placing a screening stencil over a substrate surface, through which solder paste material is deposited. A flat pressure plate then creates a confined 'captured' cell of solder paste in each stencil aperture. This configuration enables the substrate to be heated sufficiently to reflow the solder paste, after which it is cooled, leaving perfectly formed solder bumps. This method is particularly noteworthy as it allows for high-density solder bump formation, accommodating compact solder bump sizes and minimal pitch distances.

Career Highlights

Throughout his career, John T. MacKay has worked with prominent companies, including Fujitsu Corporation and Semi-Pac. His experience in these organizations has enabled him to refine his skills and focus on innovation within the electronics manufacturing sector.

Collaborations

MacKay's journey in the field of solder printing and reflow has been complemented by collaborations with talented individuals such as Thomas E. Molinaro and David G. Love. Working alongside these professionals has contributed to his knowledge and expertise in developing cutting-edge technologies.

Conclusion

John T. MacKay stands out as an innovative inventor whose patents reflect a deep understanding of solder bump technology. His contributions are not only beneficial to the companies he has worked for, but also to the broader field of electronics manufacturing. With his continued dedication to innovation, MacKay is poised to inspire future advancements in this significant area of technology.

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