John T Hoback

Title: John T. Hoback: Innovator in Photoimageable Compositions

Introduction

John T. Hoback is a notable inventor based in Naperville, Illinois. He has made significant contributions to the field of printed wiring board manufacture through his innovative patent. His work focuses on developing compositions that enhance the manufacturing process of electrical interconnecting devices.

Latest Patents

John T. Hoback holds a patent for "Photoimageable compositions and films for printed wiring board manufacture." This patent discloses compositions for forming polymeric layers that are useful in the manufacture of printed wiring boards and other electrical interconnecting devices. The compositions are typically processable in aqueous base and can be made photosensitive with the addition of a positive acting photosensitive compound. These compositions are particularly beneficial in the production of laminable films used to create printed wiring boards. The patent also covers multilayer printed wiring boards made using such films, along with methods for making and utilizing the films and boards.

Career Highlights

John T. Hoback is affiliated with The Texas A&M University System, where he contributes his expertise in the field of electrical engineering and materials science. His work has been instrumental in advancing the technology used in printed wiring boards, which are essential components in modern electronic devices.

Collaborations

Some of his notable coworkers include David P. Sinclair and Douglas E. Fjare. Their collaborative efforts have further enhanced the research and development of innovative materials and processes in the field.

Conclusion

John T. Hoback's contributions to the field of printed wiring board manufacture through his innovative patent demonstrate his commitment to advancing technology. His work continues to impact the electronics industry positively.