John T Fakler is a notable inventor based in Phoenix, Arkansas. He has made significant contributions to the field of materials science, particularly in the bonding of copper and the development of solutions for printed circuit boards. With a total of 6 patents to his name, Fakler's work has had a lasting impact on various industries.

Latest Patents

Fakler's latest patents include a method and composition for amine borane reduction of copper oxide to metallic copper. This innovative method improves the bonding of copper to resin by reducing the copper oxide layer to metallic copper using an aqueous reducing solution containing amine borane. The addition of a reducing stabilizer enhances the process, making the resulting metallic copper layer resistant to acid attack. Another significant patent involves a composition for stripping solder and tin from printed circuit boards. This method utilizes an aqueous solution of nitric acid, along with ferric ions and halide ions, to effectively dissolve solder and tin while improving the resistance between printed circuits.

Career Highlights

Throughout his career, John T Fakler has worked with several companies, including Morton International, Inc. and Surface Tek Specialty Products, Inc. His experience in these organizations has allowed him to refine his skills and contribute to advancements in material applications.

Collaborations

Fakler has collaborated with notable coworkers such as Michael G Rush and Scott Campbell. Their combined expertise has fostered innovation and development in their respective fields.

Conclusion

John T Fakler's contributions to the fields of copper bonding and circuit board solutions exemplify his innovative spirit and dedication to advancing technology. His patents reflect a commitment to improving industrial processes and materials.

This text is generated by artificial intelligence and may not be accurate.

Please report any incorrect information to support@idiyas.com