The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 10, 2001

Filed:

Oct. 01, 1997
Applicant:
Inventors:

Todd Johnson, II, Tempe, AR (US);

John T. Fakler, Phoenix, AR (US);

Assignee:

Morton International, Inc., Chicago, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 1/300 ;
U.S. Cl.
CPC ...
C09K 1/300 ;
Abstract

A composition and method for stripping tin and solder and the underlying tin-copper alloy from the copper substrate of a printed circuit board is presented. The liquid includes an aqueous solution of nitric acid in an amount sufficient to dissolve solder and tin, a source of ferric ions in an amount sufficient to dissolve the tin-copper alloy, and a source of halide ions in an amount sufficient to significantly improve the resistance between printed circuits.


Find Patent Forward Citations

Johnson, II, Todd. (2001). Composition for stripping solder and tin from printed circuit boards (U.S. Patent No. 6258294). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6258294

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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