This inventor holds 1 USPTO granted patent. Top assignee: Rohm and Haas Company. Active years: 1994.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1994
Title: John Robinson: Inventor of an Electroplating Process
Introduction
John Robinson is an inventor associated with Ayer, Massachusetts, and Rohm and Haas Company. His patent work concerns an electroplating process designed for articles with both metallic and non-metallic portions.
Latest Patents
The provided information lists one patent for Robinson: Electroplating Process and Composition. It describes forming a semiconductive coating over an article, dissolving the metal surface beneath that coating, and then removing the coating with a high-pressure water spray. The process is useful in manufacturing printed circuit boards. Robinson’s listed patent portfolio comprises 1 patent.
Career Highlights
Robinson’s documented invention addresses a specialized electroplating challenge: applying a process to articles that combine metallic and non-metallic surfaces. The patent connects this approach to printed circuit board production and is associated with his work at Rohm and Haas Company.
Collaborations
The provided information identifies John J. Bladon and Michael Rousseau as Robinson’s coworkers. It does not specify whether they collaborated with him on the patent.
Conclusion
John Robinson’s listed patent reflects an electroplating innovation intended for printed circuit board manufacturing and associated with his work at Rohm and Haas Company.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile