John Reece

Title: John Reece: Innovator in Solder Application Technology

Introduction

John Reece is a notable inventor based in Endicott, NY (US). He has made significant contributions to the field of solder application technology, particularly in methods that enhance the precision of soldering processes.

Latest Patents

John Reece holds 1 patent for his innovative work titled "Fine pitch solder application." This patent describes methods and apparatus for applying solder in precise amounts to fine pitch leads, which are essential for direct chip attachment (DCA) or flip-chip applications. The invention utilizes a heated platen to apply pressure to solder overlaying a plurality of lands on a circuitized substrate. In one embodiment, paste solder is screened through a mask with apertures corresponding to land locations. Another embodiment involves positioning a web of solder foil accurately over fine pitch lands. Each embodiment features a heated platen with active elements that match the size and shape of the area containing the fine pitch lands. Additionally, a third embodiment includes individual platens for lands designated for solder application.

Career Highlights

John Reece has had a distinguished career, working at the International Business Machines Corporation (IBM). His work has focused on advancing solder application techniques, which are critical in the electronics manufacturing industry.

Collaborations

Throughout his career, John has collaborated with notable colleagues, including Arthur L Leerssen and Everitt W Mace. These collaborations have contributed to the development and refinement of innovative soldering technologies.

Conclusion

John Reece's contributions to solder application technology demonstrate his commitment to innovation in the electronics field. His patent reflects a significant advancement in the precision of soldering processes, which is vital for modern electronic devices.