Fairport, NY, United States of America

John P Siy

This inventor holds 1 USPTO granted patent. Top assignee: Eastman-Kodak Company. Active years: 2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: John P Siy. Retrieved from https://idiyas.com/inventor/john-p-siy

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2008

Loading Chart...
1 patent (USPTO):Explore Patents

Title: John P. Siy: Packaging Apparatus Inventor

Introduction

John P. Siy is an inventor associated with Fairport, New York, and Eastman Kodak Company. His patent work includes an invention for a packaging apparatus designed to join a ridged base, end portions, and an outer sleeve.

Latest Patents

Siy is credited with 1 patent, titled “Packaging Apparatus.” The design includes a base with first and second ridges, along with end portions containing slots and channels. The channels receive the first ridges, while the slots receive the second ridges. A sleeve fits over the base and outside the ridges. At least part of the sleeve and end portions is made from corrugated material.

Career Highlights

Siy’s recorded patent reflects work on packaging structure and assembly. The apparatus uses interlocking features to connect its base and end portions, with a sleeve completing the package.

Collaborations

Siy’s listed coworkers include Kevin R. Barrell and Kevin M. Metzger. His company affiliation is Eastman Kodak Company.

Conclusion

John P. Siy’s patent documents a corrugated packaging apparatus that combines a ridged base, slotted and channeled end portions, and an exterior sleeve.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…