Location History:
- Indian Harbour Beach, FL (US) (1985 - 1989)
- Indian Harbor Beach, FL (US) (1993 - 1994)
Company Filing History:
Years Active: 1985-1994
Title: The Innovative Contributions of John P. Short
Introduction
John P. Short, a prolific inventor based in Indian Harbor Beach, FL, has made significant strides in the field of wafer bonding technology. With a total of four patents to his name, he continues to push the boundaries of innovation in semiconductor manufacturing, demonstrating exceptional ingenuity and technical prowess.
Latest Patents
Among his latest patents, two remarkable inventions stand out:
1. **Wafer bonding using trapped oxidizing vapor** - This innovative bonding method involves pressing a pair of slices together with a liquid oxidant placed between them. The process requires subjecting the slices to high temperatures, ideally at least 1100 degrees Celsius, to ensure that they bond effectively by becoming pliable.
2. **Wafer bonding process employing liquid oxidant** - Similar in technique, this method also utilizes a liquid oxidant applied to one of the slices before pressing them together. The high-temperature heating process guarantees a strong bond by allowing the materials to conform during the bonding step.
Career Highlights
John P. Short has established himself as a key player in the realm of semiconductor technology through his role at Harris Corporation. His expertise has not only led to remarkable inventions but has also positioned him as a respected figure within the industry.
Collaborations
Throughout his career, John has collaborated with esteemed colleagues such as George V. Rouse and Craig J. McLachlan. These partnerships have fostered an environment of creativity and excellence, further enhancing the impact of their collective work in the field.
Conclusion
In summary, John P. Short's contributions to semiconductor technology through his innovative patents exemplify the spirit of invention. As an inventor at Harris Corporation, his work continues to inspire advancements in wafer bonding techniques, paving the way for further innovations in the industry.