Danvers, MA, United States of America

John Nicholas Kermet

This inventor holds 2 USPTO granted patents. Top assignee: Husky Injection Molding Systems Limited. Active years: 2010-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: John Nicholas Kermet. Retrieved from https://idiyas.com/inventor/john-nicholas-kermet

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2010-2011

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2 patents (USPTO):Explore Patents

Title: John Nicholas Kermet: Innovator in Molding Technology

Introduction

John Nicholas Kermet is a notable inventor based in Danvers, MA (US). He has made significant contributions to the field of molding technology, holding a total of 2 patents. His work focuses on innovative methods and structures that enhance the molding process.

Latest Patents

Kermet's latest patents include a "Method of Molding," which discloses a technique for creating molded articles, among other applications. Another significant patent is the "Molding Structure," which outlines a new molding structure that improves efficiency and effectiveness in the molding process.

Career Highlights

Kermet is currently employed at Husky Injection Molding Systems Limited, where he applies his expertise in molding technology. His role at the company allows him to contribute to advancements in the industry and collaborate with other professionals.

Collaborations

Throughout his career, Kermet has worked alongside talented individuals such as Jeffrey Douglas MacDonald and Adam Craig Reynolds. These collaborations have fostered innovation and development in their respective fields.

Conclusion

John Nicholas Kermet is a distinguished inventor whose work in molding technology has led to valuable patents and advancements in the industry. His contributions continue to influence the field and inspire future innovations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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