Company Filing History:
Years Active: 1980-1981
Title: **Innovative Contributions of John N. Helbert**
Introduction
John N. Helbert is an esteemed inventor based in Eatontown, NJ, whose contributions to the field of integrated circuits have been significant and influential. With two patents to his name, he has played a crucial role in advancing techniques for patterning substrates essential in microelectronics.
Latest Patents
Helbert's latest patents encompass innovative methodologies critical for the fabrication of integrated circuit patterns. The first patent, titled "Method of delineating a desired integrated circuit pattern upon a circuit substrate," describes a process involving the copolymer poly(methyl alpha-chloroacrylate-co-methacrylonitrile) formed through emulsion polymerization. This copolymer is dissolved in a spinning solvent to create a viscous solution, which is subsequently applied to the substrate surface. After spinning, a uniform resist film of thickness between 0.3 to 1.0 micron is formed. The next step includes heating the film and exposing it to ionizing radiation to develop the desired pattern.
The second patent, "Method of patterning a substrate," focuses on utilizing polymethacrylonitrile dissolved in a spinning solvent to create a smooth resist film at least 3000 angstroms thick. This film undergoes heating and exposure to ionizing radiation, enhancing the dissolution rate of the irradiated region significantly compared to the unirradiated areas. The final development stage applies a mixture of acetonitrile or benzonitrile with toluene to reveal the intended pattern on the substrate.
Career Highlights
John N. Helbert is associated with the US Government as represented by the Secretary of the Army. His role there has allowed him to push the boundaries of research and development within the field of integrated circuits, significantly impacting the advancement of technology used in various applications.
Collaborations
Throughout his career, Helbert has collaborated closely with his coworker, Charles U. Pittman, Jr., contributing to the development of innovative techniques and enhancing the understanding of substrate patterning within integrated circuits. Their teamwork illustrates the importance of collaboration in achieving significant breakthroughs in technical fields.
Conclusion
John N. Helbert's innovative patents in the realm of integrated circuits exemplify the critical advancements in technology crucial for future developments in microelectronics. His contributions, combined with fruitful collaborations, highlight the vital role inventors play in shaping the domains of technology and engineering, ensuring continued progress in these fields.
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