This inventor holds 1 USPTO granted patent. Top assignee: Silego Technology Inc.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: John McDonald: Inventor of an Integrated-Circuit Packaging Substrate.
Introduction
John McDonald is an inventor associated with Sunnyvale, California, and Silego Technology Inc. His listed patent concerns a packaging substrate designed to support integrated circuits and circuit components.
Latest Patents
McDonald is credited with 1 patent, titled “Packaging substrate.” The invention describes a substrate with an upper surface for mounting an integrated circuit or circuit component and an opposite lower surface for attachment to a printed circuit board. It uses a plastic, non-conductive material with an inductor structure at least partially embedded within it. Conductive materials and pillars form two coils with inductance, arranged as a toroidal transformer in a double-helix configuration.
Career Highlights
The available information connects McDonald’s inventive work to Silego Technology Inc. His patent focuses on integrating transformer structures into a packaging substrate, combining component mounting and electrical functionality within the substrate.
Collaborations
McDonald’s listed coworker is David Kunteh Chow. The provided information does not specify further details about their collaboration.
Conclusion
John McDonald’s patent presents a packaging-substrate design that incorporates a double-helix toroidal transformer, highlighting his contribution to integrated-circuit packaging technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile