John M Frusco

Title: John M. Frusco: Innovator in Semiconductor Packaging

Introduction

John M. Frusco is a notable inventor based in Scotch Plains, NJ (US), recognized for his contributions to the field of semiconductor packaging. With a total of 2 patents, Frusco has made significant advancements that cater to the evolving demands of the electronics industry.

Latest Patents

Frusco's latest patents include innovative stamping tools designed for the precise handling of delicate lead frames used in semiconductor packages. These tools incorporate sequential punch and die sets that define tabs, bend down leads, score tabs, and coin lead tips. The design allows for the efficient movement of frame strips over tab-bending dies without interference, ensuring a streamlined manufacturing process. Another significant patent is the stamped lead frame for ceramic dual-in-line packages, which addresses the need for precision packaging in high-volume applications. This invention utilizes break-off tabs to maintain the spatial relation of fragile leads, ultimately replacing more expensive etched parts.

Career Highlights

Frusco has dedicated his career to enhancing semiconductor packaging techniques, particularly through his work at Plessey Incorporated. His innovative approaches have not only improved manufacturing efficiency but have also contributed to cost reductions in the production of integrated circuits.

Collaborations

Throughout his career, Frusco has collaborated with esteemed colleagues such as Herbert Bothner and Dieter Spieth, further enriching the development of semiconductor technologies.

Conclusion

John M. Frusco's contributions to semiconductor packaging through his patents and collaborative efforts have significantly impacted the industry. His work continues to pave the way for advancements in electronic manufacturing processes.