Company Filing History:
Years Active: 1992
Title: John M Brauer: Innovator in Multi-Layer Circuit Board Technology
Introduction
John M Brauer is a notable inventor based in Binghamton, NY (US). He has made significant contributions to the field of electronic circuit packaging. His innovative approach has led to the development of a unique method for fabricating metal core layers for multi-layer circuit boards.
Latest Patents
John M Brauer holds 1 patent for his invention titled "Method for fabricating metal core layers for a multi-layer circuit board." This patent discloses a method of creating a multilayer electronic circuit package that includes a circuitized, polymer-encapsulated metal core. The process involves using a metal foil for the core, which can be provided as a single unit or through a continuous roll-to-roll process. The method includes drilling, etching, or punching vias and through holes in the metal foil, applying an adhesion promoter, and depositing a dielectric polymer to create a conformal coating. This innovative approach enhances the functionality and reliability of electronic circuit packages.
Career Highlights
John M Brauer is associated with the International Business Machines Corporation (IBM), where he has contributed to advancements in electronic circuit technology. His work has been instrumental in improving the manufacturing processes of multi-layer circuit boards.
Collaborations
Throughout his career, John has collaborated with notable colleagues, including Frederick R Christie and William H Lawrence. These collaborations have further enriched his contributions to the field of electronics.
Conclusion
John M Brauer's innovative methods in circuit board technology exemplify the importance of creativity and collaboration in engineering. His contributions continue to influence the development of advanced electronic systems.