This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 1992.
Company Filing History:
Years Active: 1992
Title: John M Atkinson: Innovator in Microelectronic Packaging
Introduction
John M Atkinson is a notable inventor based in Endwell, NY (US). He has made significant contributions to the field of microelectronics, particularly in the area of circuit board fabrication. His innovative methods have paved the way for advancements in microelectronic packaging.
Latest Patents
Atkinson holds a patent for a "Method of additive circuitization of circuit boards with high adhesion." This patent discloses a method for fabricating a microelectronic package, especially one that features copper circuitization on a dielectric substrate. The process involves depositing, imaging, and developing photoresist for additive circuitization, followed by forming a pattern of copper circuitization on the exposed portions of the package. To prevent the formation of harmful air bubbles on the exposed walls of the imaged and developed resist, the panel is treated with a liquid mist.
Career Highlights
John M Atkinson is associated with the International Business Machines Corporation (IBM), where he has contributed to various projects in microelectronics. His work has been instrumental in enhancing the efficiency and reliability of microelectronic packages.
Collaborations
Atkinson has collaborated with notable colleagues, including Russell E Darrow and Ronald J Moore. Their combined expertise has fostered innovation and development in the field of microelectronics.
Conclusion
John M Atkinson's contributions to microelectronic packaging through his innovative patent demonstrate his commitment to advancing technology in this critical field. His work continues to influence the industry and inspire future innovations.