John L Zich

Title: Innovations by John L Zich in Metallization Processes

Introduction

John L Zich is a notable inventor based in Albuquerque, NM (US). He has made significant contributions to the field of metallization processes, holding a total of 2 patents. His work focuses on improving the methods used for metallizing substrates, which has applications in various industries.

Latest Patents

Zich's latest patents include two innovative processes for metallization. The first patent, titled "Process for metallization of a substrate by curing a catalyst applied thereto," describes an improved additive process. In this process, a catalyst solution is applied to a substrate's surface, and metallic catalytic clusters are formed by heating the substrate. This allows for electroless plating to deposit metal onto the coated surface, with additional thickness achieved through electrolytic plating. The second patent, "Process for metallization of a substrate by irradiative curing," follows a similar approach but utilizes irradiation to form metallic clusters on the substrate surface. This method also enables electroless plating and subsequent electrolytic plating for enhanced metallization.

Career Highlights

John L Zich is currently associated with Sandia Corporation, where he continues to innovate in the field of metallization. His work has been instrumental in advancing the technology used in various applications, contributing to the efficiency and effectiveness of metallization processes.

Collaborations

Zich has collaborated with notable coworkers, including Ken S Chen and William P Morgan. Their combined expertise has likely contributed to the successful development of Zich's innovative processes.

Conclusion

John L Zich's contributions to metallization processes through his patents demonstrate his commitment to innovation in this field. His work at Sandia Corporation and collaborations with other experts highlight the importance of teamwork in advancing technology.