John L Leicht

Title: Innovations of John L. Leicht

Introduction

John L. Leicht is a notable inventor based in Hawthorn Woods, Illinois. He has made significant contributions to the field of electronics through his innovative patents. With a total of seven patents to his name, Leicht has focused on improving solder paste technology and electronic assembly methods.

Latest Patents

One of Leicht's latest patents addresses the issue of solder paste hardening over time, which can lead to wasted materials and production downtime. This invention describes a solder paste where the metal alloy is coated with an agent that inhibits the reaction with dicarboxylic acid. By using monocarboxylic acids to coat the metal alloy powder, the polymer chains are truncated, preventing hardening. Another patent involves an electronic assembly that includes multiple solder connections, which are fabricated by reflow heating a less compliant solder paste and a compliant preform. This innovative method allows for better stress transfer during thermal cycling, enhancing the reliability of electronic devices.

Career Highlights

Leicht has spent a significant part of his career at Motorola Corporation, where he has been instrumental in developing advanced soldering techniques. His work has contributed to the efficiency and effectiveness of electronic manufacturing processes.

Collaborations

Throughout his career, Leicht has collaborated with talented individuals such as William R. Bratschun and Hugh Robert Malone. These partnerships have fostered innovation and have led to the successful development of several patents.

Conclusion

John L. Leicht's contributions to the field of electronics through his innovative patents have made a lasting impact on the industry. His work continues to influence the development of more efficient electronic assembly methods.