John Joseph Garrity

Title: The Innovations of John Joseph Garrity

Introduction

John Joseph Garrity is a notable inventor based in Strathclyde, GB. He has made significant contributions to the field of electronic packaging, holding a total of five patents. His work focuses on enhancing the design and functionality of electronic components, particularly in the area of ball grid array packages.

Latest Patents

One of Garrity's latest patents is titled "Enhanced Pad Design for Substrate." This innovation involves a ball grid array electronic package that is attached to a substrate using solder balls and solder paste. The connection is established between a contact on the ball grid array and a solder ball through a first joining medium, such as solder paste. Additionally, a second joining medium connects the solder ball to a contact arranged on the substrate. The contact on the substrate is designed to be substantially quadrilateral, and preferably square in shape. This design allows for easier detection of connections to the substrate, especially when using round solder balls, which can be more easily identified by x-ray compared to round pads with smaller diameters.

Career Highlights

Garrity's career is marked by his association with the International Business Machines Corporation, commonly known as IBM. His work at IBM has allowed him to develop and refine his innovative ideas, contributing to advancements in electronic packaging technology.

Collaborations

Throughout his career, Garrity has collaborated with several talented individuals, including John James Hannah McMorran and Alan P Downie. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

John Joseph Garrity's contributions to the field of electronic packaging through his innovative patents and collaborations highlight his importance as an inventor. His work continues to influence the industry and pave the way for future advancements in technology.