San Diego, CA, United States of America

John Jong Hoon Lee

This inventor holds 1 USPTO granted patent. Top assignee: Qualcomm Incorporated. Active years: 2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: John Jong Hoon Lee. Retrieved from https://idiyas.com/inventor/john-jong-hoon-lee-audcxrfy

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: Innovations by John Jong Hoon Lee

Introduction

John Jong Hoon Lee is a notable inventor based in San Diego, California. He has made significant contributions to the field of integrated device packaging, particularly through his innovative designs that enhance electronic components.

Latest Patents

John Jong Hoon Lee holds a patent for an "Integrated device package comprising a tunable inductor." This patent features a package substrate that includes at least one dielectric layer, an inductor within that layer, and multiple terminals for connectivity. The design includes a first terminal configured as a port for the inductor, a second terminal as another port, and a third terminal serving as a dummy terminal. The patent also describes various implementations, including a solder resist layer and solder interconnects that enhance the functionality of the device.

Career Highlights

John Jong Hoon Lee is currently employed at Qualcomm Incorporated, a leading company in the telecommunications and semiconductor industry. His work focuses on developing advanced technologies that improve the performance and efficiency of electronic devices.

Collaborations

Throughout his career, John has collaborated with talented individuals such as Young Kyu Song and Sangjo Choi. These collaborations have contributed to the advancement of innovative solutions in the field of electronics.

Conclusion

John Jong Hoon Lee's contributions to integrated device packaging exemplify the spirit of innovation in technology. His patent and work at Qualcomm Incorporated highlight his role in shaping the future of electronic components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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