This inventor holds 1 USPTO granted patent. Top assignee: Amazon Technologies, Inc.. Active years: 2018.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2018
Title: John Harvey Lucas: Innovator in Electronic Device Packaging
Introduction
John Harvey Lucas is a notable inventor based in San Francisco, CA. He has made significant contributions to the field of electronic device packaging. With a focus on innovative solutions, Lucas has developed a unique approach to packaging that enhances usability and functionality.
Latest Patents
Lucas holds a patent for an electronic device package. This package includes an enclosure designed to securely hold an electronic device. It features a closure flap that is coupled to the top of the package, allowing for easy access. The closure flap includes a tear strip that can be used to open the package. Additionally, a sled is incorporated within the package, consisting of a substantially planar backplane and a sleeve. The electronic device is held in a gap between the backplane and the sleeve. A portion of the top edge of the package, located under the closure flap, is recessed to expose a pull tab of the sled when the flap is opened. The package also includes a hole formed through at least one surface, enabling it to be hung for display or storage.
Career Highlights
Lucas is currently employed at Amazon Technologies, Inc., where he continues to innovate in the realm of electronic packaging. His work has contributed to the advancement of packaging solutions that meet the demands of modern technology.
Collaborations
Throughout his career, Lucas has collaborated with talented individuals such as Paul Grady Russell and Karl Anton Bakker. These collaborations have fostered a creative environment that encourages the development of groundbreaking ideas.
Conclusion
John Harvey Lucas is a distinguished inventor whose work in electronic device packaging has made a significant impact. His innovative designs and collaborative efforts continue to shape the future of packaging technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
