Durham, NC, United States of America

John H Lee

USPTO Granted Patents = 2 

 

Average Co-Inventor Count = 3.7

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2017-2024

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2 patents (USPTO):

Title: Innovations of John H Lee

Introduction

John H Lee is a notable inventor based in Durham, NC (US). He has made significant contributions to the field of data storage and management, holding 2 patents that showcase his innovative approach to technology.

Latest Patents

One of his latest patents is titled "Per-service storage of attributes." This patent describes a method performed by a data storage apparatus for maintaining filesystem object attributes in connection with multiple drivers. Each driver is configured to operate on a respective set of filesystem objects. The method includes creating driver-specific storage volumes, storing attributes specific to filesystem objects, and utilizing these stored attributes while operating on particular filesystem objects. Another significant patent is "Maintaining data consistency when data is changed out from under another data service." This patent presents an improved technique for managing conflicts over data changes between a data change initiator and multiple listeners. It allows listeners to prevent the initiator from changing data, enhancing data consistency and reliability.

Career Highlights

John H Lee is currently employed at EMC IP Holding Company LLC, where he continues to innovate and contribute to advancements in data storage technology. His work has had a profound impact on how data is managed and stored in modern computing environments.

Collaborations

Some of his notable coworkers include Alan Lee Taylor and Milind M Koli, who have collaborated with him on various projects within the company.

Conclusion

John H Lee's contributions to the field of data storage through his patents reflect his innovative spirit and dedication to improving technology. His work continues to influence the industry and pave the way for future advancements.

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