John Frank Surowka

Title: Innovations of John Frank Surowka

Introduction

John Frank Surowka is a notable inventor based in Binghamton, NY (US). He has made significant contributions to the field of materials science, particularly in the development of laminates with reduced coefficients of thermal expansion (CTE). With a total of five patents to his name, Surowka's work has implications for various applications in electronics and circuit design.

Latest Patents

One of Surowka's latest patents is a method for reducing the coefficient of thermal expansion in chip attach packages. This invention presents a simple and inexpensive solution for creating a reduced CTE laminate and circuitized structures. The laminate comprises a specific composition of resin, curing agents, woven cloth, and non-woven quartz mat. The method involves several steps, including the preparation of non-woven quartz mat and the sandwiching of this mat between layers of prepreg. This innovative approach aims to enhance the performance and reliability of electronic components.

Career Highlights

Surowka is currently employed at International Business Machines Corporation (IBM), where he continues to innovate and develop new technologies. His work at IBM has allowed him to collaborate with other talented professionals in the field, further advancing the state of materials used in electronic applications.

Collaborations

Some of Surowka's notable coworkers include Robert Maynard Japp and Lawrence Robert Blumberg. Their collaborative efforts contribute to the innovative environment at IBM, fostering advancements in technology and materials science.

Conclusion

John Frank Surowka's contributions to the field of materials science, particularly through his patents related to reduced CTE laminates, highlight his role as a significant inventor. His work continues to influence the development of reliable electronic components, showcasing the importance of innovation in technology.