John Ettlinger

Title: The Innovations of John Ettlinger: A Pioneer in Sputter Target Technology

Introduction

John Ettlinger, a notable inventor based in W. Nyack, NY, has made significant contributions to the field of materials science through his innovative approaches in sputtering target technology. With a patented method that enhances the production of high-density sputter targets, Ettlinger's work has impacted various industries requiring sophisticated materials.

Latest Patents

Ettlinger's sole patent, titled "Method of making unreacted metal/aluminum sputter target," describes a cutting-edge technique for creating a high-performance sputtering target. This method involves the combination of aluminum and non-aluminum reactive metal powder blends that undergo cold pressing, followed by machining and hot pressing under specific conditions. The resultant sputter target consists of over 2% aluminum, ensuring a uniform composition throughout its body, which is crucial for its performance in various applications.

Career Highlights

Throughout his career, John Ettlinger has worked with prestigious companies such as Sony Corporation and Materials Research Corporation. These experiences have not only allowed him to hone his skills as an inventor but have also provided a platform for his innovations to reach wider markets.

Collaborations

Ettlinger has collaborated with esteemed colleagues like Suresh Annavarapu and Tony Sica. Their collective efforts and expertise have contributed to advancements in the field, enhancing the development of high-performance materials.

Conclusion

John Ettlinger stands out as an innovative inventor whose work in the fabrication of sputter targets represents a significant advancement in materials science. His patented method holds promise for various applications, and his collaborations demonstrate the importance of teamwork in driving technological progress. Ettlinger's contributions will likely influence future developments in the industry for years to come.