John E Stephan

Title: John E Stephan: Innovator in Wafer Measurement Technology

Introduction

John E Stephan is a notable inventor based in Rochester, NY (US), recognized for his contributions to the field of wafer measurement technology. With a total of 2 patents, he has developed innovative methods and systems that enhance the accuracy and efficiency of measuring wafer thickness.

Latest Patents

Stephan's latest patents include a "Method and apparatus for measuring wafer thickness" and an "Automated optical surface profile measurement system." The first patent describes a system for non-contact measurement of the thickness of a test object using a laser beam split into two identical input beams. This system utilizes a calibration object of known thickness to reflect beams from the sides of the test object, allowing for precise thickness determination. The second patent outlines a fully automated surface profiling system that features a loading chamber and a measurement chamber equipped with a phase differential laser optical scanning system. This system is designed to hold and orient wafers for surface profile measurement, with operations controlled by a programmable CPU.

Career Highlights

John E Stephan is currently employed at Chapman Instruments, Inc., where he applies his expertise in developing advanced measurement technologies. His work has significantly contributed to the field, making him a respected figure among his peers.

Collaborations

Stephan has collaborated with notable coworkers, including Silvio P Marchese-Ragona and Robert Bryant, who have contributed to his innovative projects.

Conclusion

John E Stephan's work in wafer measurement technology exemplifies the spirit of innovation and dedication to advancing the field. His patents reflect a commitment to improving measurement accuracy and automation in the industry.