John E Evert

Title: John E Evert: Innovator in Microelectronic Packaging

Introduction

John E Evert is a notable inventor based in Phoenix, AZ (US). He has made significant contributions to the field of microelectronics, particularly in the design and fabrication of microelectronic packages. His innovative work has led to the development of a unique patent that enhances the efficiency and performance of microelectronic devices.

Latest Patents

John E Evert holds 1 patent for his invention titled "Die-in-heat spreader microelectronic package." This patent describes microelectronic packages that include a microelectronic die disposed within a recess in a heat spreader. The invention also details the fabrication of build-up layers of dielectric materials and conductive traces on both the microelectronic die and the heat spreader. Additionally, it outlines methods for aligning the microelectronic die within the heat spreader, which is crucial for ensuring optimal performance. In another embodiment, the microelectronic die is placed on a heat spreader surrounded by a filler material, further enhancing the package's functionality.

Career Highlights

John E Evert is currently employed at Intel Corporation, a leading company in the technology sector. His work at Intel has allowed him to push the boundaries of microelectronic packaging, contributing to advancements that benefit a wide range of electronic applications.

Collaborations

Throughout his career, John has collaborated with esteemed colleagues, including Qing Ma and Harry H Fujimoto. These collaborations have fostered an environment of innovation and have led to the successful development of cutting-edge technologies in microelectronics.

Conclusion

John E Evert's contributions to microelectronic packaging exemplify the spirit of innovation in the technology industry. His patent and work at Intel Corporation highlight his commitment to advancing microelectronic technologies.