Mesquite, TX, United States of America

John E Barnett, Jr


Average Co-Inventor Count = 6.5

ph-index = 2

Forward Citations = 77(Granted Patents)


Company Filing History:


Years Active: 1996-2007

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2 patents (USPTO):Explore Patents

Title: John E Barnett, Jr: Innovator in Seismic Telemetry and Integrated Circuit Packaging

Introduction

John E Barnett, Jr. is a notable inventor based in Mesquite, TX (US), recognized for his contributions to the fields of seismic telemetry and integrated circuit packaging. He holds 2 patents that showcase his innovative approach to technology and engineering.

Latest Patents

Barnett's latest patents include a seismic telemetry system and a package for integrated circuits. The seismic telemetry system is designed for remotely controlling, acquiring, and monitoring the acquisition of seismic data. This system incorporates remote equipment for collecting seismic data and transmitting communication signals to and from a remote location. Additionally, it features local equipment for managing these communication signals, allowing for effective control and monitoring of seismic data collection at remote sites. His second patent, the package for integrated circuits, presents a novel design that includes a package base with a patterned layer of material forming a substrate. This substrate supports a microstrip transmission line and is covered by a plastic encapsulant, enhancing the functionality and reliability of integrated circuits.

Career Highlights

Throughout his career, Barnett has worked with prominent companies such as Input/Output, Inc. and Texas Instruments Corporation. His experience in these organizations has contributed significantly to his expertise in technology and innovation.

Collaborations

Barnett has collaborated with notable professionals in the industry, including James W Iseli and Kambiz Afkami. These collaborations have likely enriched his work and expanded his impact in the field of inventions.

Conclusion

John E Barnett, Jr. stands out as an influential inventor whose work in seismic telemetry and integrated circuit packaging has made a significant impact on technology. His innovative patents and career achievements reflect his dedication to advancing engineering solutions.

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