Texas Instruments Corporation

Input/output, Inc.

John E Barnett, Jr

Henry F Breit

James A Forster

Lawrence Philip Behn

Thomas M Buie

James W Iseli

Stephen R Nelson

Susan V Bagen

Glen R Haas

Kambiz Afkami

Thomas G Leete

Douglas J Darrow

A system for remotely controlling, acquiring and monitoring the acquisition of seismic data. The system includes remote equipment for collecting seismic data and for transmitting and receiving communication signals to and from a remote location. The system also includes local equipment for transmitting and receiving communication signals to and from the remote location. In this manner, the collection of seismic data at remote locations can be controlled and monitored locally.

Seismic telemetry system

In one form of the invention, a package for integrated circuits and devices (42), (46) is disclosed, the package including: a package base (44), the base having a first top surface; a layer of material (43) on the first top surface of the base (44) wherein the material (43) is patterned to cover a portion of the base, and wherein the layer of material (43) forms a substrate having a second top surface; a microstrip transmission line (45) on the second top surface; and a plastic encapsulant (50), wherein the encapsulant covers the first top surface of the base.

Package for integrated circuits

Growing community of inventors

Mesquite, TX, United States of America

John E Barnett, Jr