Middleborough, MA, United States of America

John E Ahearn

This inventor holds 2 USPTO granted patents. Top assignee: Isotronics, Inc.. Active years: 1987-1988.


% Patents Active = 100.0

Average Co-Inventor Count = 6.5

ph-index = 2

Forward Citations = 28(Granted Patents)


Company Filing History:


Years Active: 1987-1988

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2 patents (USPTO):Explore Patents

Title: Innovations of John E Ahearn

Introduction

John E Ahearn is a notable inventor based in Middleboro, MA (US). He has made significant contributions to the field of hermetic sealing technologies. With a total of 2 patents, Ahearn's work focuses on enhancing the performance and reliability of glass-to-metal seals.

Latest Patents

Ahearn's latest patents include innovations in duplex glass preforms for hermetic glass-to-metal compression sealing. The first patent describes a duplex glass preform designed to form hermetic glass-to-metal seals of the compression type. This preform features a glass infrastructure modified by the selective distribution of ceramic particles. The ceramic particles create a density gradient, with the highest concentration at the surface, gradually decreasing with depth. This design is particularly useful for forming glass-to-metal compression seals in hybrid metal packages containing microcircuit chips. The second patent also focuses on duplex glass preforms for hermetic glass-to-metal sealing, emphasizing similar structural modifications and applications.

Career Highlights

Ahearn is currently associated with Isotronics, Inc., where he continues to innovate in the field of hermetic sealing technologies. His work has been instrumental in advancing the reliability of electronic packaging.

Collaborations

Some of Ahearn's notable coworkers include Raymond A Frates and Dennis Girard. Their collaborative efforts contribute to the innovative environment at Isotronics, Inc.

Conclusion

John E Ahearn's contributions to the field of hermetic sealing technologies demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of material science and engineering, paving the way for advancements in electronic packaging.

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