Company Filing History:
Years Active: 2006-2007
Title: Innovations by Inventor John DeGenova
Introduction
John DeGenova is a notable inventor based in Garland, Texas, recognized for his significant contributions to the field of semiconductor technology. With two patents to his name, DeGenova has developed innovative systems that enhance the performance and reliability of semiconductor substrates.
Latest Patents
DeGenova's latest invention is a system for ultraviolet atmospheric seed layer remediation. This groundbreaking system provides a method for removing organic contaminants from a copper seed layer that has been deposited on a semiconductor substrate. The invention features a specialized housing that encloses the semiconductor substrate, protecting it during the remediation process.
Inside the housing, an ultraviolet radiation source is strategically positioned to expose the semiconductor substrate to ultraviolet radiation. This process effectively desorbs the contaminants from the seed layer, thereby ensuring the quality and efficiency of the semiconductor devices produced.
Career Highlights
John DeGenova's innovative work at Texas Instruments Corporation highlights his commitment to advancing technology in the semiconductor industry. His inventions are a testament to his expertise and dedication, contributing to the company's reputation as a leader in electronics and semiconductor solutions.
Collaborations
Throughout his career, DeGenova has worked alongside talented professionals, including coworkers Aaron L. Frank and David Gonzalez, Jr. These collaborations have undoubtedly played a significant role in the development of his patented technologies and have fostered a dynamic environment for innovation at Texas Instruments.
Conclusion
In summary, John DeGenova stands out as a distinguished inventor in the semiconductor field. With his innovative patents and collaborations at Texas Instruments Corporation, he continues to contribute positively to technological advancements. His work not only impacts his immediate environment but also has implications for future semiconductor technologies and applications.