Naperville, IL, United States of America

John D Chapman

This inventor holds 1 USPTO granted patent. Top assignee: Van Den Bergh Foods Co., Division of Conopco, Inc.. Active years: 1993.

IDiyas Innovation Intelligence. (2026). Inventor Profile: John D Chapman. Retrieved from https://idiyas.com/inventor/john-d-chapman

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 1993

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1 patent (USPTO):Explore Patents

Title: John D. Chapman: Inventor of Reduced-Fat Pie Products

Introduction

John D. Chapman is an inventor associated with Naperville, Illinois, and the food company Van Den Bergh Foods Co., a division of Conopco, Inc. His patent work addresses the formulation of pie products with reduced fat.

Latest Patents

Chapman is credited with 1 patent: “Reduced Fat Pies and Methods of Preparing the Pies.” The invention describes pie dough or pie crust containing less fat, including a combination of hard vegetable fat and a softer fat. The patent also outlines a method for preparing the pie product.

Career Highlights

Chapman’s documented patent contribution focuses on food product development, specifically adapting pie dough and crust formulations to reduce fat while using different types of fat in the product.

Collaborations

Chapman’s listed coworker is Peter M. Gautchier. The patent record also associates Chapman with Van Den Bergh Foods Co., a division of Conopco, Inc.

Conclusion

John D. Chapman’s patent reflects an effort to develop reduced-fat pie products through a formulation combining hard vegetable fat with softer fat.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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