This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 1997.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1997
Title: Innovations of John Charles Panner
Introduction
John Charles Panner is a notable inventor based in Underhill, Vermont. He has made significant contributions to the field of thin film technology. His work primarily focuses on improving measurement techniques in thin film structures.
Latest Patents
Panner holds a patent for an "Assembly and method for making in process thin film thickness measurements." This innovative assembly is designed to facilitate thickness measurements in thin film structures. It includes a chemical-mechanical planarization (CMP) subassembly that effects topographical changes in the thin film structure. Additionally, a measuring subassembly is interposed with the CMP subassembly, allowing for thickness measurements to be made during and independent of CMP process operations. He has 1 patent to his name.
Career Highlights
John Charles Panner is associated with the International Business Machines Corporation, commonly known as IBM. His work at IBM has allowed him to explore and develop advanced technologies in the field of thin films. His contributions have been instrumental in enhancing the precision of measurements in various applications.
Collaborations
Panner has collaborated with several talented individuals in his field, including Martin Patrick O'Boyle and Thomas Edwin Sandwick. These collaborations have fostered innovation and have led to advancements in their respective areas of expertise.
Conclusion
John Charles Panner's work in thin film technology exemplifies the spirit of innovation. His patent and contributions to IBM highlight his commitment to advancing measurement techniques in this critical area. His achievements continue to influence the field and inspire future innovations.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
