North Royalton, OH, United States of America

John C Chesna

This inventor holds 1 USPTO granted patent. Top assignee: E.i. Dupont De Nemours and Company. Active years: 1995.

IDiyas Innovation Intelligence. (2026). Inventor Profile: John C Chesna. Retrieved from https://idiyas.com/inventor/john-c-chesna

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 1995

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1 patent (USPTO):Explore Patents

Title: John C. Chesna and His Compression-Molding Patent.

Introduction

John C. Chesna is an inventor associated with North Royalton, Ohio, and E. I. du Pont de Nemours and Company. His recorded patent concerns compression molding fiber-reinforced thermoplastic materials.

Latest Patents

Chesna is credited with 1 patent, titled “Compression Molding of Structures.” The invention describes heating and applying pressure to fiber-reinforced thermoplastic resin to form an article, followed by cooling the mold directionally from bottom to top. This sequential cooling creates a thermal gradient intended to promote directional solidification of the material.

Career Highlights

Chesna’s patent work is associated with E. I. du Pont de Nemours and Company, a company known for research and development in materials and chemical technologies. His patent highlights an approach to controlling solidification during the manufacture of fiber-reinforced thermoplastic structures.

Collaborations

Wayne F. Gentile and Subhotosh Khan are identified as Chesna’s coworkers. The available information does not specify their roles in the patent or whether they collaborated directly on the invention.

Conclusion

John C. Chesna’s recorded invention focuses on directional cooling as a way to control solidification in compression-molded, fiber-reinforced thermoplastic articles.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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