Skelmorlie, United Kingdom

John Brown

This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 1995.

IDiyas Innovation Intelligence. (2026). Inventor Profile: John Brown. Retrieved from https://idiyas.com/inventor/john-brown-y0ncr99d

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 15(Granted Patents)


Company Filing History:


Years Active: 1995

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1 patent (USPTO):Explore Patents

Title: The Innovations of John Brown

Introduction

John Brown is a notable inventor based in Skelmorlie, GB. He has made significant contributions to the field of electronics, particularly in the area of printed circuit board technology. His innovative approach has led to the development of a unique method for solder deposition.

Latest Patents

John Brown holds a patent for a "Method of and apparatus for depositing solder on a printed circuit board." This invention involves melting solder in a container that features a slot for the passage of solder. The control means within the apparatus can alternately allow and prevent the passage of solder through the slot. The slot is designed to be in contact with a stencil, and the control means is actuated to permit the solder to flow through the slot. As the stencil moves relative to the container, solder is deposited onto the printed circuit board via the stencil. This innovative method enhances the efficiency and precision of solder application in electronic manufacturing.

Career Highlights

John Brown is currently employed at International Business Machines Corporation, commonly known as IBM. His work at IBM has allowed him to further develop his skills and contribute to cutting-edge technology in the electronics industry.

Collaborations

Throughout his career, John has collaborated with talented individuals such as Kenneth Skene Murray and James Andrew McNee. These collaborations have fostered a creative environment that has led to further advancements in their respective fields.

Conclusion

John Brown's contributions to the field of electronics, particularly through his patented method for solder deposition, highlight his innovative spirit and dedication to advancing technology. His work at IBM and collaborations with other professionals underscore the importance of teamwork in driving innovation forward.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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