Sterling Heights, MI, United States of America

John Bengt Abrahamsson

This inventor holds 1 USPTO granted patent. Top assignee: Visteon Global Technolgoies, Inc.. Active years: 2001.

IDiyas Innovation Intelligence. (2026). Inventor Profile: John Bengt Abrahamsson. Retrieved from https://idiyas.com/inventor/john-bengt-abrahamsson

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2001

Loading Chart...
1 patent (USPTO):Explore Patents

Title: John Bengt Abrahamsson: Innovator in Electronic Module Testing

Introduction

John Bengt Abrahamsson is a notable inventor based in Sterling Heights, MI (US). He has made significant contributions to the field of electronic module testing, particularly in the durability of solder joints under thermal stress. His innovative approach has led to advancements in ensuring the reliability of electronic components.

Latest Patents

Abrahamsson holds a patent for a method titled "Method for specifying accelerated thermal cycling tests for electronic solder joint durability." This patent outlines a comprehensive method for testing electronic modules to evaluate solder joint failures caused by thermally induced stress. The process involves determining a thermal shock endurance test profile that reflects field temperature conditions, estimating the time and cycles to failure of solder joints using numerical simulation techniques, and selecting a design life duration for the module. The method further compares the design life duration with the estimated time to failure of the weakest solder joint, ultimately determining the robustness of the module design.

Career Highlights

Abrahamsson is associated with Visteon Global Technologies, Inc., where he applies his expertise in electronic module testing. His work focuses on enhancing the reliability of electronic components, which is crucial in various applications across industries. His innovative methods have contributed to improved product performance and longevity.

Collaborations

Throughout his career, Abrahamsson has collaborated with esteemed colleagues, including Robert Charles Harris and Robert Emmett Murray. These collaborations have fostered a productive environment for innovation and have led to significant advancements in their field.

Conclusion

John Bengt Abrahamsson is a distinguished inventor whose work in electronic module testing has made a lasting impact on the industry. His patented methods for evaluating solder joint durability are essential for ensuring the reliability of electronic components. His contributions continue to influence advancements in technology and product development.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…