Lincoln, NE, United States of America

John A Reigle


Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 56(Granted Patents)


Company Filing History:


Years Active: 1996-2000

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2 patents (USPTO):Explore Patents

Title: Innovations of John A Reigle

Introduction

John A Reigle is a notable inventor based in Lincoln, NE (US). He has made significant contributions to the field of composite materials and well flow conductors. With a total of two patents to his name, Reigle's work showcases his expertise and innovative spirit.

Latest Patents

Reigle's latest patents include an "Interface system between composite tubing and end fittings" and a "Composite well flow conductor." The interface system is designed to connect a filament composite tube with a rigid interior end fitting. It features a plurality of traplocks with varying wall thicknesses and angles of the bearing faces. Additionally, a Y-shaped seal is positioned between the fitting and the composite tube. The composite well flow conductor consists of a composite liner tube made of overlapping, resin-bonded composite plies, which is capable of conducting fluid flow. Surrounding this liner tube is a composite outer structure that also comprises overlapping, resin-bonded composite plies arranged in opposed helices. This design allows for the centralization of the well flow conductor within a larger casing.

Career Highlights

Throughout his career, John A Reigle has worked with prominent companies such as Halliburton Company and Technical Products Group, Inc. His experience in these organizations has contributed to his development as an inventor and innovator in the field.

Collaborations

Reigle has collaborated with notable coworkers, including Donald D Baldwin and John C Gano. These partnerships have likely enriched his work and led to further advancements in his inventions.

Conclusion

John A Reigle's contributions to the field of composite materials and well flow conductors highlight his innovative capabilities. His patents reflect a commitment to advancing technology in these areas.

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