Brockport, NY, United States of America

John A Olenick


Average Co-Inventor Count = 3.2

ph-index = 4

Forward Citations = 175(Granted Patents)


Location History:

  • Thompson, CT (US) (1994)
  • Brockport, NY (US) (1994 - 1995)

Company Filing History:


Years Active: 1994-1995

Loading Chart...
4 patents (USPTO):Explore Patents

Title: Innovations by John A Olenick

Introduction

John A Olenick is a notable inventor based in Brockport, NY (US). He has made significant contributions to the field of circuit manufacturing, holding a total of four patents. His work focuses on innovative methods for creating multilayer circuits and circuit boards.

Latest Patents

Olenick's latest patents include a "Method of manufacturing a multilayer circuit" and a "Method of manufacturing a multilayer circuit board." The first patent describes a process where a circuit assembly is manufactured using an additive method with layers of fluoropolymer composite material and conductive material. This innovative approach eliminates the need for a barrier metal layer, allowing for a more efficient stacking of circuit assemblies. The second patent outlines methods for fabricating multilayer circuits, emphasizing the use of polymeric and ceramic substrates to create solid conductive interconnects through lamination under heat and pressure.

Career Highlights

John A Olenick is currently associated with Rogers Corporation, where he continues to develop and refine his innovative techniques in circuit manufacturing. His work has been instrumental in advancing the technology used in multilayer circuits, making them more efficient and reliable.

Collaborations

Olenick has collaborated with notable coworkers such as Richard T Traskos and Robert C Daigle, contributing to the collective expertise and innovation within his field.

Conclusion

John A Olenick's contributions to circuit manufacturing through his patents and work at Rogers Corporation highlight his role as a significant inventor in the industry. His innovative methods continue to shape the future of multilayer circuit technology.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…