Esslingen, Germany

Johannes Hoos

USPTO Granted Patents = 1 


 

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Johannes Hoos: Innovator in Connection Interface Technologies

Introduction: Johannes Hoos, an inventive mind hailing from Esslingen, Germany, has made significant strides in the field of device connectivity and component integration. His innovative contributions focus on enhancing how various components communicate and perform within complex systems, particularly through his patented technology.

Latest Patents: Hoos holds a notable patent for a "Device with components connected via a connection interface and method for connecting components." This invention addresses the need for efficiently handling and processing parts by incorporating two subassemblies that connect through a specialized interface. The device allows for electrical power transmission and fluid transport between the subassemblies, providing a versatile solution. Notably, the design accommodates multiple orientations for connection, promoting flexibility in its application.

Career Highlights: Currently working with Afag Holding AG, Johannes Hoos has been instrumental in developing innovative technologies that optimize component interaction. His background in engineering and commitment to advancing connectivity solutions have positioned him as a valuable asset to his team and the industry.

Collaborations: Throughout his career, Hoos has worked alongside talented professionals, including Friedrich Durand and Tobias Frasch. Their collaborative efforts have fostered an environment of creativity and innovation, enabling the development of groundbreaking technologies in the field of component connection.

Conclusion: Johannes Hoos stands out as a dedicated inventor whose work contributes meaningfully to the advancement of connectivity technologies. His patent underscores the importance of seamless integration in modern devices, paving the way for enhanced performance and efficiency in various applications. As he continues to collaborate with industry experts, there is no doubt that his future contributions will further transform the landscape of device connectivity.

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