Joel Elwood Wing

Title: The Innovative Contributions of Joel Elwood Wing

Introduction

Joel Elwood Wing is a notable inventor based in Escondido, California. He has made significant contributions to the field of integrated circuit packaging through his innovative patent. His work focuses on improving the recycling process of substrates from integrated circuit packages, which is crucial for sustainable technology practices.

Latest Patents

Joel Elwood Wing holds a patent for a "Process for recycling a substrate from an integrated circuit package." This patent outlines a method that involves a grinding step, a dissolving step, and a disintegrating step. The grinding step effectively removes the integrated circuit chip from the substrate while also grinding a portion of the filler layer and solder balls. Following this, the dissolving step removes the remaining filler layer, and the disintegration step utilizes ultrasonic vibration to break down the partial solder balls. This innovative process leaves the substrate with small solder mounds, making it easier to attach another integrated circuit chip.

Career Highlights

Wing is associated with Unisys Corporation, where he applies his expertise in integrated circuit technology. His work at Unisys has allowed him to contribute to advancements in electronic recycling and sustainability. His innovative approach has garnered attention in the industry, showcasing his commitment to improving technology processes.

Collaborations

Joel has collaborated with notable colleagues, including Kenneth Patrick Reilich and Ronald Allen Norell. These collaborations have further enhanced his work and contributed to the development of innovative solutions in the field.

Conclusion

Joel Elwood Wing's contributions to the field of integrated circuit packaging and recycling are commendable. His innovative patent demonstrates a commitment to sustainability and technological advancement. His work continues to influence the industry positively.