This inventor holds 1 USPTO granted patent. Top assignee: Texas Instruments Corporation. Active years: 2021.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2021
Title: Joe Ann Feive Carbonell Lopez: Innovator in Semiconductor Packaging
Introduction
Joe Ann Feive Carbonell Lopez is a notable inventor based in Baguio, Philippines. He has made significant contributions to the field of semiconductor packaging, showcasing his innovative spirit and technical expertise. His work has led to the development of a unique semiconductor package design that enhances performance and reliability.
Latest Patents
Joe Ann Feive Carbonell Lopez holds a patent for a "Package with shifted lead neck." This semiconductor package features a pad and leads with a planar profile shaped from a planar base metal. The design includes a semiconductor die attached to the pad, a wire bond extending from the semiconductor die to a respective lead, and a mold compound that covers the semiconductor die, the wire bond, and a portion of the respective lead. Notably, a second portion of the lead extends beyond the mold compound, with a shape that includes a notch and a protrusion, each partially covered by the mold compound.
Career Highlights
Joe Ann Feive Carbonell Lopez is currently employed at Texas Instruments Corporation, a leading company in the semiconductor industry. His role at Texas Instruments allows him to apply his innovative ideas and contribute to the advancement of technology in semiconductor packaging.
Collaborations
Throughout his career, Joe Ann has collaborated with talented individuals such as Kevin John Bersamira Delos Santos and Dolores Babaran Milo. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Joe Ann Feive Carbonell Lopez exemplifies the spirit of innovation in the semiconductor industry. His patent and contributions to Texas Instruments Corporation highlight his commitment to advancing technology and improving semiconductor packaging solutions.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
