Sant Cugat del Vallès, Spain

Joaquim Bea Bonet

This inventor holds 1 USPTO granted patent. Top assignee: Hewlett-Packard Development Company, L.p.. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Joaquim Bea Bonet. Retrieved from https://idiyas.com/inventor/joaquim-bea-bonet

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Joaquim Bea Bonet: Innovator in Image Curing Technology

Introduction

Joaquim Bea Bonet is a notable inventor based in Sant Cugat del Valles, Spain. He has made significant contributions to the field of image curing technology. His innovative approach has led to the development of a unique patent that enhances the efficiency of curing images on various substrates.

Latest Patents

Joaquim holds a patent titled "Determining a parameter for curing images." This patent describes a method that involves identifying the substrate, determining its deformation temperature, and calculating a curing parameter using a fuzzy logic algorithm. The method ultimately enables a printing apparatus to cure images effectively based on the determined parameters. Joaquim has 1 patent to his name.

Career Highlights

Joaquim Bea Bonet is currently employed at Hewlett-Packard Development Company, L.P. His work at this esteemed organization has allowed him to further explore and develop his innovative ideas in image processing and printing technologies.

Collaborations

Throughout his career, Joaquim has collaborated with talented individuals such as Michel Georges Encrenaz and Pablo Vidal Alvarez. These collaborations have contributed to the advancement of technology in their respective fields.

Conclusion

Joaquim Bea Bonet is a distinguished inventor whose work in image curing technology has made a significant impact. His innovative methods and collaborations continue to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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