Landsberg, Germany

Joachim Wokurka

This inventor holds 1 USPTO granted patent and 1 published patent application and 1 EPO patent. Top assignee: Cfs Germany Gmbh. Active years: 2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Joachim Wokurka. Retrieved from https://idiyas.com/inventor/joachim-wokurka

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: Innovations by Joachim Wokurka

Introduction

Joachim Wokurka is a notable inventor based in Landsberg, Germany. He has made significant contributions to the field of packaging technology. His innovative approach has led to the development of a unique machine designed for creating packaging with form-fit connections.

Latest Patents

Wokurka holds a patent for a "Machine for making packaging with form-fit connection." This invention relates to a packaging system that includes a packaging tray, which can be filled with a product and closed with a lid. The design features at least one form-fit connection that links the packaging tray to the lid, incorporating first and second connection elements. This invention also encompasses a method for producing such packaging and a packaging machine.

Career Highlights

Joachim Wokurka is associated with CFS Germany GmbH, where he applies his expertise in packaging solutions. His work has been instrumental in advancing the efficiency and effectiveness of packaging technologies.

Collaborations

Wokurka has collaborated with notable colleagues, including Dietmar Send and Peter Riegger, contributing to various projects within the company.

Conclusion

Joachim Wokurka's innovative contributions to packaging technology exemplify the impact of inventive thinking in industry. His patent for a machine that creates form-fit packaging showcases his commitment to enhancing product packaging solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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