Company Filing History:
Years Active: 2011-2014
Title: Innovations by Inventor Joachim Trinks
Introduction
Joachim Trinks is a notable inventor based in Flawil, Switzerland. He has made significant contributions to the field of electronics, particularly in the placement of semiconductor components. With a total of 2 patents, his work showcases innovative methods and apparatuses that enhance the efficiency of electronic component placement.
Latest Patents
Trinks' latest patents include a "Method and apparatus for the placement of electronic components, in particular semiconductor chips on a substrate." This invention provides an apparatus that includes a supply station for semiconductor wafers, a placement station for substrates, and a transport apparatus that moves semiconductor chips from the wafer to the substrate. The design features a pivoting pick-up tool and a placement tool that work together to ensure precise bonding of the semiconductor chip to the substrate.
Another significant patent is the "Method and device for detaching a component which is attached to a flexible film." This invention allows for controlled detachment of components from a film without causing damage. The film is placed on a detaching tool that utilizes negative pressure to facilitate a smooth detaching process, ensuring the integrity of the component.
Career Highlights
Throughout his career, Joachim Trinks has worked with reputable companies such as Kulicke and Soffa Die Bonding GmbH and Kulicke & Soffa (Switzerland) Management GmbH. His experience in these organizations has contributed to his expertise in the field of semiconductor technology.
Collaborations
Trinks has collaborated with notable professionals in his field, including Andreas Marte and Wolfgang Herbst. These collaborations have likely enriched his work and contributed to the development of his innovative patents.
Conclusion
Joachim Trinks is a distinguished inventor whose contributions to semiconductor technology have led to the development of innovative methods and devices. His patents reflect a commitment to enhancing the efficiency and precision of electronic component placement.