Method and apparatus for the placement of electronic components, in particular semi conductor chips on a substrate

Abstract

An apparatus for the placement of a semiconductor chip on a substrate is provided. The apparatus includes: (a) a supply station adapted to include a semiconductor wafer in a substantially horizontal position, the semiconductor wafer including the semiconductor chip; (b) a placement station positioned entirely above the supply station, the placement station being adapted to support the substrate; and (c) a transport apparatus entirely above the supply station, the transport apparatus moving the semiconductor chip from the semiconductor wafer to the substrate, the transport apparatus including (1) a pivoting pick-up tool that removes the semiconductor chip from the semiconductor wafer, the pivoting pick-up tool being arranged on a rotary arm, the rotary arm rotates about a horizontal axis to raise the semiconductor chip to a transfer position entirely above the semiconductor wafer through an ascending curved movement, (2) a placement tool that moves the semiconductor chip to the placement station and bonds the semiconductor chip on the substrate at the placement station, and (3) at least one pivoting transfer tool that transfers the semiconductor chip from the pivoting pick-up tool to the placement tool, each of the at least one pivoting transfer tool being arranged on a respective rotary arm to rotate about a respective horizontal axis to raise the semiconductor chip along a respective ascending curved movement.