Company Filing History:

Years Active: 2002-2026
Title: Innovations by Joachim Junge in Semiconductor Wafer Grinding
Introduction
Joachim Junge is a notable inventor based in Burghausen, Germany. He has made significant contributions to the field of semiconductor wafer processing, holding a total of 5 patents. His work focuses on improving the efficiency and precision of grinding techniques used in the semiconductor industry.
Latest Patents
One of Joachim Junge's latest patents is titled "Simultaneous double-side grinding of semiconductor wafers." This invention addresses the correction of grinding spindle positions in double-side grinding machines. By torsionally coupling the two grinding spindles, each equipped with a grinding disk flange, he has developed a method that allows for precise adjustments during the grinding process. The inclusion of a measuring unit with an inclinometer and sensors enables the determination of radial and axial correction values, ensuring symmetrical orientation of the grinding spindles.
Another significant patent is the "Method for grinding semiconductor wafers." This method involves processing semiconductor wafers to remove material on one or both sides using at least one grinding tool. A unique aspect of this invention is the adjustment of the coolant flow rate based on the grinding tooth height of the tool, which is reduced as the height decreases. This innovation enhances the grinding process by optimizing coolant usage.
Career Highlights
Throughout his career, Joachim Junge has worked with various companies, including Siltronic AG. His expertise in semiconductor technology has allowed him to contribute to advancements in the industry, particularly in grinding techniques.
Collaborations
Joachim has collaborated with notable professionals in his field, including Robert Weiss and Anton Huber. These partnerships have facilitated the exchange of ideas and innovations, further enhancing the development of semiconductor processing technologies.
Conclusion
Joachim Junge's contributions to semiconductor wafer grinding through his innovative patents demonstrate his commitment to advancing technology in this critical field. His work continues to influence the efficiency and effectiveness of semiconductor manufacturing processes.